The Dow Chemical Company’s DOW business unit Dow Electronic Materials has secured a New Product Introduction (NPI) Award from Printed Circuit Design and Fab (PCD&F) Magazine for its MICROFILL platform. The company received the recognition this time for MICROFILL LVF 4 Acid Copper.
Dow MICROFILL LVF 4 Acid Copper provides outstanding microvia filling and panel plating uniformity for circuit boards to increase signal transmission between smart devices.
Since 2009, PCD&F has conferred Dow Electronics with four NPI Awards, including EVF Solution for microvia fill, THF Solution for through-hole fill, and LVF 3 and LVF 4 Solutions for blind via fill in High-Density-Interconnect circuit boards and IC substrates.
Dow Electronics not only develops industry-leading solutions but also supports emerging opportunities such as the needs associated with Internet of Things. The unit caters to the needs of the customers and provides them with innovative products.
Recently, Dow achieved another milestone in the goal of reducing its own carbon footprint. The company announced that its Energy business has signed a long-term agreement with a new wind farm in South Texas to reduce carbon emission.
The farm is presently under construction by a subsidiary of Bordas Wind Energy, LLC – a joint venture between MAP and Enerverse, LLC. This venture is part of Dow’s Energy Plan and its Sustainability Goals.
Dow currently carries a Zacks Rank #3 (Hold).
Better-ranked stocks in the diversified chemical space include Asahi Kasei Corp. AHKSY, Innospec Inc. IOSP and Air Products & Chemicals Inc. APD. While Asahi Kasei and Innospec sport a Zacks Rank #1 (Strong Buy), Air Products carries a Zacks Rank #2 (Buy).
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