Leading semiconductor solutions provider Broadcom Corporation (BRCM) recently announced the launch of a range of single-chip hybrid direct broadcast satellite and terrestrial system-on-a-chip (SoC) devices for set-top boxes. To be exhibited at the upcoming IBC2014 (International Broadcasting Convention) in Amsterdam, the new family of SoCs will be available with integrated MoCA (Multimedia over Coax Alliance) as well as non-MoCA.
The family of eight SoCs feature high-efficiency video compression (HEVC) technology facilitating broadcasters to deliver competitive channel line-ups and improved content quality through lower spectrum footprint. These devices also combine HEVC with advanced modulation efficiencies and high-performance IP connectivity. The common platform design enables Original Equipment Manufacturers (OEMs) to quickly deploy region-specific offerings. The new range of HEVC enabled chipsets will ensure that set-top boxes using the chips will remain relevant through 2020 and further.
Broadcom is focused on and specializes in innovating technologies related to connectivity, bandwidth and content, which enable it to capture a substantial market share in the segment.
Based in Irvine, CA, Broadcom is engaged in designing and marketing semiconductor components of network voice, video, and data traffic for various applications. The company continues to drive innovation and engineering excellence across a broad range of communication end markets to help its customers enhance device performance and overall efficiency.
Broadcom currently has a Zacks Rank #2 (Buy). Other stocks that look promising and are worth a look in the industry include TriQuint Semiconductor, Inc. (TQNT) and Cypress Semiconductor Corporation (CY), both carrying a Zacks Rank #1 (Strong Buy) and DSP Group Inc (DSPG), carrying a Zacks Rank #2 (Buy).
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